CFP mechanical platform

ABSTRACT

In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. ProvisionalApplication Ser. No. 61/089,393, entitled “PLUGGABLE TRANSCEIVER MODULEAND HOST DEVICE WITH THUMBSCREW DESIGN,” filed Aug. 15, 2008. Thepresent application also claims the benefit of U.S. ProvisionalApplication Ser. No. 61/042,981, entitled “DUAL POWER HEATS INK SYSTEMFOR AN ELECTRONIC MODULE,” filed Apr. 7, 2008.

BACKGROUND OF THE INVENTION

1. The Field of the Invention

The present invention generally relates to high speed optoelectronicmodules and host devices. In particular, some example embodiments relateto a mechanical platform for pluggable modules and host devices

2. The Related Technology

Conventional mechanical platforms implemented in optical networksinclude a pluggable module configured to be plugged into a host deviceto convert electrical data signals to optical data signals and viceversa. Specific functionality, dimensions, and/or other functionality ofsuch mechanical platforms are often standardized by a multi-sourceagreement (“MSA”), such as the X2 MSA, XPAK MSA, and/or XENPAK MSA, forexample.

Traditional pluggable modules, including X2, XPAK, and XENPAKform-factor modules, include a narrow channel defined along oppositesides of the module that run the length of the module. Host devicesinclude corresponding narrow guiderails. To plug such a module into ahost device, the module channels are aligned with the host guiderailsand the module is pushed into the host device, the module channelsengaging the host guiderails to ensure proper alignment of the modulewithin the host device. Once plugged in, a module connector in the backof the module and a host connector in the host device provide anelectrical interface between the module and the host device.

Additionally, traditional pluggable modules are commonly secured in hostdevices by two short thumbscrews which engage threaded receptacles inthe front panel of the host device. To this end, the module typicallyincludes an oversize module front panel with two flanges that extendoutward from opposing sides of the module, one thumbscrew being insertedthrough each flange. The flanges typically overlap a significant amountof the host front panel to provide enough metal for the thumbscrews tothread into. The overlap is increased by the requirement that thethumbscrews avoid the space behind the module front panel and the hostfront panel occupied by the module itself and the narrow guiderails ofthe host device.

As a result of the required overlap, the footprint of the module frontpanel and flanges extends significantly beyond the footprint of the mainbody of the module as viewed from the front of the module. Consequently,the maximum number of modules that can be plugged into a single hostdevice is limited by the module front panel and flanges, and not by themain body of the module.

Further, the attachment of traditional pluggable modules to the frontpanel of the host device can make containment of electromagneticinterference (“EMI”) at the back of the module difficult to achieve.Specifically, attaching the module to the front panel of the host devicecan result in a good EMI seal between the module flange and the hostfront panel. However, tolerance stackup in the plugging directionresults in a highly variable position of the module connector withrespect to the host connector from one module to another such that aconventional elastomeric EMI gasket, which has a limited compressionrange, positioned between the back of the module and the host connectoris inadequate for providing EMI containment.

Additionally, the tolerance stackup is typically compensated for byincreasing the length of contacts within the module connector and/orhost connector. The increased contact length allows for greatervariation in the position of the module connector with respect to thehost connector. Additionally, however, the increased contact lengthincreases EMI emissions of each lengthened contact and can result inlarge contact stubs that extend beyond the points of contact betweencontacts in the module connector and contacts in the host connector. Thelarge stubs create inductive discontinuities that degrade high speedsignal integrity and further exacerbate EMI emissions.

On the other hand, the back of the module can be secured directly to thehost connector, rather than securing the module front panel directly tothe host front panel, to improve the EMI seal at the interface betweenthe back of the module and the host connector. Such an arrangement wouldadditionally allow shorter contact lengths to be used in the moduleconnector and host connector as tolerance stackup would not be an issueat that interface. However, the tolerance stackup would then have to bedealt with at the interface between the module front panel and the hostfront panel, preventing the module front panel from being directlysecured to the host front panel and compromising the EMI seal at thatinterface.

Additionally, some MSAs specify belly-to-belly configurations where afirst module is positioned on top of a host printed circuit board(“PCB”) and a second module is positioned upside down on the bottom ofthe host PCB directly beneath the first module. In such a configuration,the two modules are usually separated by only a few millimeters, orlittle more than the thickness of the host PCB. The presence of theoversized module front panel in the X2, XENPAK and other pluggablemodules precludes belly-to-belly configurations with these modules sincethe oversized module front panel prevents the modules from beingpositioned sufficiently close together.

Moreover, thickness tolerances for PCBs are usually plus or minus tenpercent. The resulting large variations in PCB thickness from one PCB tothe next make it difficult to design host systems that can absorb thevariations.

The subject matter claimed herein is not limited to embodiments thatsolve any disadvantages or that operate only in environments such asthose described above. Rather, this background is only provided toillustrate one exemplary technology area where some embodimentsdescribed herein may be practiced

BRIEF SUMMARY OF THE INVENTION

In general, example embodiments of the invention relate to a mechanicalplatform for pluggable modules and host devices.

In one example embodiment, a pluggable module includes a shell with afront, back, and first and second sides. A first guiderail protrudesfrom the first side and extends from the front of the shell to the backof the shell. A second guiderail protrudes from the second side and alsoextends from the front of the shell to the back of the shell. A firstthumbscrew runs the length of the module and is housed within the firstguiderail. A second thumbscrew also runs the length of the module and ishoused within the second guiderail. The two thumbscrews are configuredto secure the module to a host device when the module is plugged intothe host device.

In another example embodiment, a system includes a host device and apluggable module configured to be plugged into the host device. The hostdevice includes a host printed circuit board and a host connectorcoupled to the host printed circuit board. The host connector defines arecessed slot configured to receive a module connector of the pluggablemodule. A first guide and a second guide are coupled to the host printedcircuit board, each defining a channel configured to receive guiderailsof the pluggable module. A host bezel is coupled to the first and secondguides and defines an opening configured to receive the pluggablemodule. The pluggable module includes a front, back, and two sides. Amodule connector is disposed at the back of the pluggable module and isconfigured to be inserted into the recessed slot of the host connector.A first guiderail protrudes from the first side of the pluggable moduleand is configured to engage a channel of the first guide. A secondguiderail protrudes from the second side of the pluggable module and isconfigured to engage a channel of the second guide.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be obvious from thedescription, or may be learned by the practice of the invention. Thefeatures and advantages of the invention may be realized and obtained bymeans of the instruments and combinations particularly pointed out inthe appended claims. These and other features of the present inventionwill become more fully apparent from the following description andappended claims, or may be learned by the practice of the invention asset forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

To further clarify the above and other advantages and features of thepresent invention, a more particular description of the invention willbe rendered by reference to specific embodiments thereof which areillustrated in the appended drawings. It is appreciated that thesedrawings depict only typical embodiments of the invention and aretherefore not to be considered limiting of its scope. The invention willbe described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 discloses an example mechanical platform including a host deviceand a pluggable optoelectronic module;

FIGS. 2A-2E disclose example embodiments of a pluggable optoelectronicmodule and module connector;

FIG. 3 discloses an example host device, including a host bezel, hostguides, and host connector;

FIGS. 4A-4C disclose an example host bezel that can be implemented inthe host device of FIG. 3;

FIGS. 5A-5D disclose an example host guide that can be implemented inthe host device of FIG. 3;

FIGS. 6A-6H disclose example embodiments of a host connector that can beimplemented in the host device of FIG. 3; and

FIGS. 7A-7B disclose aspects of a mechanical platform according toembodiments of the invention when the pluggable optoelectronic module isplugged into the host device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The principles of the embodiments described herein describe thestructure and operation of several examples used to illustrate thepresent invention. It should be understood that the drawings arediagrammatic and schematic representations of such example embodimentsand, accordingly, are not limiting of the scope of the presentinvention, nor are the drawings necessarily drawn to scale. Well-knowndevices and processes have been excluded so as not to obscure thediscussion in details that would be known to one of ordinary skill inthe art.

The embodiments disclosed herein are generally related to a mechanicalplatform for a pluggable optoelectronic module and a host device that iscapable of receiving the pluggable optoelectronic module. Theembodiments disclosed herein may be implemented on various types ofoptoelectronic modules of various operating speeds and various formfactors, including, but not limited to, the emerging 100 G Form-factorPluggable (“CFP”) Multi-Source Agreement (“MSA”) form factor. As usedherein, the term “optoelectronic module” includes modules having bothoptical and electrical components. Examples of optoelectronic modulesinclude, but are not limited to transponders, transceivers,transmitters, and/or receivers. Optoelectronic modules can be used, forinstance, in telecommunications networks, local area networks, metroarea networks, storage area networks, wide area networks, and the like.

FIG. 1 illustrates an example mechanical platform 100 according toembodiments of the invention which includes an optional heatsink 110, apluggable optoelectronic module 200 (“module 200”), and a host 300. Asshown, the module 200 is configured to be plugged into the host 300 aswill be explained in more detail to follow. In addition, the optionalheatsink 110 is configured to be removably attached to the host 300. Asdisclosed in FIG. 1, the heatsink 110 includes a plurality of fins 110Aextending from a top surface of the heatsink 110. A gap 110B is definedbetween each pair of fins 110A. As disclosed in FIG. 1, the width w₁ ofeach fin 110A is about three times the width w₂ of each gap 110B. Inother words, the ratio (w₁:w₂) of the width w₁ of each fin 110A and thewidth w₂ of each gap 110B is about 1:3.

In some embodiments, a plurality of shoulder screws 112A-112D removablysecures the heatsink 110 to the host 300. Optionally, each of theshoulder screws 112A-112D can include a compression spring. Forinstance, each of shoulder screws 112A and 112B include compressionspring 114A and 114B, respectively. The compression springs 114A, 114Bare configured to bias the shoulder screws 112A and 112B upwards (e.g.,in the positive y-direction) away from the host 300. When the shoulderscrews 112A and 112B are aligned with corresponding holes on the host300, a user can exert a downward force (e.g., in the negativey-direction) on the shoulder screws 112A and 112B to overcome the upwardbias from compression springs 114A and 114B to install the shoulderscrews 112A and 112B into the corresponding holes on the host 300. Onceinstalled, the compression springs 114A-114B, and correspondingcompression springs included with shoulder screws 112C-112D, serve tobias the heatsink 110 against the top surface of the module 200.

I. Pluggable Module

Reference is now made to FIGS. 2A, 2B, 2C and 2D, which disclose detailsof a pluggable optoelectronic module according to embodiments of theinvention. In particular, FIGS. 2A and 2B disclose perspective views ofthe module 200, a top shell of the module 200 being removed in FIG. 2B.FIG. 2C discloses a cross-sectional view of the module 200. FIG. 2Ddiscloses a perspective view of an alternative low power module 200B.FIG. 2E discloses a perspective view of a module connector that can beimplemented in the modules 200, 200B of FIGS. 2A-2D.

As shown, the module 200 includes a shell assembly 210 comprising topshell 212 and bottom shell 214. Alternately, a monolithic shell can beimplemented instead of a shell assembly 210. The top and/or bottom shell212, 214 can be made using any reasonable material known in the art.Although not shown, a thermal pad, thermal gel, or other thermallyconductive material can be placed on the top shell 212 when the module200 is inserted into the host 300 to thermally couple the optionalheatsink 110 to the module 200 and improve the ability of the optionalheatsink 110 to receive and dissipate heat away from the module 200.

With additional reference to FIGS. 2B and 2C, The top and bottom shells212, 214 are configured to enclose a printed circuit board (“PCB”) 216,which can include various electronic, optical, and/or optoelectroniccomponents coupled thereto. A pad pattern 218 extends from the PCB 216into a module connector 250 configured to mate with a corresponding hostconnector (see FIGS. 6A-6H) of the host 300. The pad pattern 218includes a plurality of contact pads, each contact pad configured to becoupled to a corresponding contact in the module connector 250.

Guiderails 222, 224 protrude laterally at the junction of the top shell212 and bottom shell 214 from opposite sides of the module 200 andextend along the length of the module 200. However, it is not requiredin all embodiments that the guiderails 222, 224 protrude laterally atthe junction of the top shell 212 and bottom shell 214. For instance,the guiderails can protrude from opposite sides of the module 200 aboveand/or below the junction of the top and bottom shells 212, 214 or fromopposite sides of a module that includes a monolithic shell rather thana shell assembly 210. The guiderails 222, 224 are configured to engagechannels on the host 300, as will be discussed in more detail to follow.

Thumbscrews 226 and 228 are housed within guiderails 222, 224 andprotrude through module front panel 230 at the front of the module 200and extend along the full length of the module 200, as best seen in FIG.2B. A threaded end 226A and 228A of each thumbscrew 226 and 228,respectively, extends from the back of the module 200 for mating withthe host 300.

In some embodiments, the thumbscrews 226 and 228 include a compressionspring 232, 234 (FIG. 2B) located near the head of the thumbscrews 226and 228. The compression springs 232, 234 are configured to bias thethumbscrews 226 and 228 in an outward position, which may beapproximately 6 millimeters (“mm”) in some embodiments. Prior toplugging the module 200 into the host 300, the ends 226A and 228A ofthumbscrews 226, 228 are retracted into the guiderails 222, 224 due tothe outward bias force exerted by the compression springs 232, 234.

When a user desires to plug the module 200 into the host 300, the useraligns the guiderails 222, 224 with corresponding channels on the host300 and pushes the module 200 into the host 300. At that time, the usercan exert an inward pressure on the heads of the outwardly biasedthumbscrews 226 and 228 to overcome the outward biasing effect of thecompression springs 232, 234, which causes the threaded ends 226A, 228Ato enter corresponding threaded holes in the host 300. The user can thentighten the thumbscrews 226, 228 to securely fasten the module 200 intohost 300.

The module 200 additionally includes an electromagnetic interference(“EMI”) collar 236 surrounding the front of the module 200. The EMIcollar 236 operates in conjunction with a host bezel (see FIGS. 4A-4B)to create an EMI shield around the front of the module 200 when pluggedinto the host 300.

With additional reference to FIG. 2D, a second embodiment 200B of apluggable module is illustrated that can alternately or additionally beimplemented in the mechanical platform 100 of FIG. 1. In particular, themodule 200B can be implemented for low profile, low power applications.The module 200B is similar in some respects to the module 200 of FIGS. 1and 2A and includes guiderails 222, 224 and integrated thumbscrews 226,228. However, the module 200B has a shell assembly 210A that includes atop shell 212A with an integrated low profile heatsink 213, in contrastto the smooth top shell 212 of FIG. 2A. As disclosed in FIG. 1, theintegrated heatsink 213 includes a plurality of fins 213A extending froma top surface of the integrated heatsink 213. A gap 213B is definedbetween each pair of fins 213A. In the example embodiment disclosed inFIG. 1, the width w₃ of each fin 213A is about equal to the width w₄ ofeach gap 213B. In other words, the ratio of the width of each fin 213Aand the width of each gap 213B in the example embodiment disclosed inFIG. 1 is about 1:1. Thus the fin/gap ratio of the integrated heatsink213 (1:1) is greater than the fin/gap ratio the heatsink 110 (1:3).Additionally, the module 200B is configured for low power applications.In some embodiments of the invention, the optional heatsink 110 isomitted from the mechanical platform 100 when the module 200B isimplemented.

With additional reference to FIG. 2E, the module connector 250 isdisclosed in greater detail. The module connector 250 includes a body252 and a plurality of contacts 254, 256. The body 252 comprises plasticdielectric in some embodiments, although the body 252 can alternately oradditionally comprise other reasonable materials. The body 252 includesa tongue 258 configured to be inserted into a corresponding recessedslot of a host connector (see FIGS. 6A-6H). In some embodiments, thetongue 258 is a different thickness, measured in the y-direction, thanthe PCB 216. For instance, the tongue 258 can be approximately 2.2millimeters thick in some embodiments while the PCB 216 is less than 2.2millimeters thick. Alternately, the tongue 258 and PCB 216 can besubstantially the same thickness in other embodiments. The tongue 258 issurrounded by a shoulder 260, which is also configured to be insertedinto the corresponding recessed slot of the host connector. As will bediscussed further below, the insertion of the shoulder into the recessedslot of the host connector reduces air exposure to the contacts 254, 256of the module connector 250.

The contacts 254, 256 include a plurality of upper contacts 254 and aplurality of lower contacts 256, both of which are partially embedded onthe top and bottom surfaces, respectively, of the tongue 258. Thecontacts 254, 256 then extend forwards from the body 252. Theforward-extending portions of the contacts 254, 256 are configured tostraddle mount on the edge of the PCB 216. More particularly, theforward-extending portions of the upper contacts 254 are configured tocouple to contact pads included in the pad pattern 218 on the topsurface of the PCB 216 while the forward-extending portions of the lowercontacts 256 are configured to couple to contact pads included in thepad pattern 218 on the bottom surface (not shown) of the PCB 216. Duringassembly, after the module connector 250 has been straddle-mounted tothe edge of the PCB 216, the forward-extending portions of the upper andlower contacts 254, 256 can be reflow soldered or otherwise coupled tocorresponding contact pads of the pad pattern 218.

As previously mentioned, in some embodiments the tongue 258 is adifferent thickness than the PCB 216. The thickness difference of thetongue 258 and PCB 216 can enable the use of straight contacts 254, 256(see FIG. 7A) rather than joggled contacts. The use of straight contacts254, 256 can reduce and/or eliminate electrical discontinuities in theelectrical path provided by the module connector 250 and can furthersimplify manufacturing of the module connector 250 in some embodiments.

II. Host

With additional reference to FIG. 3, additional details regarding thehost 300 are disclosed. As shown, the host 300 includes a host PCB 310configured to include various electronic, optical, and/or optoelectroniccomponents. A front panel 312 provides protection for the host 300 anddefines one or more openings 314 for receiving one or more modules 200.

The host 300 further includes a host bezel 400, host guides 500A and500B, and host connector 600. Briefly, the host bezel 400 defines anopening configured to receive a module 200 and is configured to createan EMI shield around the front of the module in conjunction with EMIcollar 236. The host bezel 400 is coupled through the front panel 312 tohost guides 500A and 500B. Each of the host guides 500A, 500B defines achannel 508A, 508B configured to receive one of the guiderails 222 or224 of the module 200. After the guiderails 222, 224 are aligned withchannels 508A, 508B and the module 200 is inserted into the host 300,the back end of the module 200 contacts host connector 600 and the hostconnector 600 receives the module connector 250. The thumbscrews 226,228 secure the module 200 to the host connector 600.

A. Host Bezel

In greater detail, and as disclosed in FIGS. 4A and 4B, the host bezel400 includes a base 402 defining an opening 403 configured to receivethe module 200. Guiderail cutouts 404 and 405 formed in the base 402 atthe perimeter of the opening 403 are configured to receive theguiderails 224, 222 of module 200.

A rim extends forward (e.g., in the positive z-direction) from the base402 and includes a top 406A, bottom 406B, and two sides 406C, 406D(collectively referred to as “rim 406”). The EMI collar 236 of themodule 200 is configured to contact the interior surface of the rim 406in a wiping motion when the module 200 is inserted into the host 300 toform an EMI shield at the interface of the host bezel 400 with themodule 200. Thus, the contact formed between the EMI collar 236 and theinterior surface of the rim 406 can be referred to as a “wipingcontact.” The wiping contact geometry between the EMI collar 236 and theinterior surface of the rim 406 is configured to be tolerant of largevariations in tolerance stackup in the z-direction.

A plurality of through holes 410A, 410B, 410C and 410D (referred tocollectively as “through holes 410”) are formed in the base 402. Each ofthe through holes 410 is configured to receive a fastener, such as ascrew, bolt, or the like, for coupling the host bezel 400 to guiderail500A, 500B through host panel 312, as will be described in greaterdetail below.

Although not required in all embodiments, the opening 403 in FIGS. 4Aand 4B is asymmetric with respect to the x-axis and substantiallysymmetric with respect to the y-axis. The asymmetry with respect to thex-axis in this example prevents the module 200 from being insertedincorrectly into the host 300 since the cross section of the module 200,shown in FIG. 2C, is only complementary to the opening 403 in a singleorientation relative to the opening 403. Alternately or additionally,the opening 403 defined in the host bezel 400 can be substantiallysymmetric or asymmetric with respect to both the x-axis and the y-axis.

According to embodiments of the invention, the base 402 can furtherinclude a channel (not shown) configured to receive an EMI gasket 412disclosed in FIG. 4B. The EMI gasket 412 is configured to form an EMIshield at the interface of the host bezel 400 with the front panel 312of the host 300 and can include elastomeric materials or otherreasonable materials.

The host bezel 400 can be made from any reasonable material and can bedie-cast, machined, or the like. Although illustrated as a separatecomponent from the front panel 312 of FIG. 3, the host bezel 400 canalternately be integrally formed with the front panel 312 as a singlecomponent.

According to embodiments of the invention, the host bezel 400 can beimplemented with a front panel 312 defining an opening 314 that islarger than the opening 403, as best seen in FIG. 4C. In particular,FIG. 4C discloses a cross-section in the y-z plane of the host bezel 400in a potential assembled orientation relative to the front panel 312. Asshown, the front panel 312 includes a guiderail cutout 316 formed in thefront panel 312 at the perimeter of the opening 314. Notably, the height316A of the guiderail cutout 316 is greater than the height 404A of theguiderail cutout 404. Similarly, the height 314A of the opening 314 isgreater than the height 403A of the opening 403. A plurality ofoversized through holes configured to align with the through holes 410can further be formed in the front panel 312. As a result of theoversize opening 314 and oversized through holes in the front panel 312,the position of the host bezel 400—and consequently that of the hostguides 500A, 500B—can be adjusted up or down (e.g., in the positive ornegative y-direction) relative to the front panel 312 to accommodatelarge mechanical assembly tolerances caused by thickness variation inthe host PCB 310.

B. Host Guide

One embodiment of a universal host guide 500 is disclosed in FIGS. 5Aand 5B that may correspond to the host guides 500A and 500B of FIG. 3.According to this embodiment, the host guide 500 can be oriented on oneside of the host 300 of FIG. 3 as host guide 500A and can be oriented onthe other side as host guide 500B. The host guide 500 can be formed ofany reasonable material, including, but not limited to, aluminum, or thelike.

The host guide 500 includes a length member 502, a first end 504, and asecond end 506. A channel 508 is defined along the length of the hostguide 500 from the first end 504 and along the length member 502 to thesecond end 506. The channel 508 is configured to receive a correspondingguiderail 222 or 224 of the module 200 when the module is inserted intothe host 300. Each of the first end 504 and the second end 506 include aplurality of flanges 510A-510B and 510C-510D, respectively, formed onthe first end 504 and the second end 506. A plurality of tapped holes512A-512D are defined in the flanges 510A-510D. As used herein, a“tapped hole” refers to a through hole or a cavity that containsinternal threads.

In some embodiments, the tapped holes 512A-512D allow the host bezel 400to be secured to the host guide 500 via a plurality of screws, bolts, orthe like. In particular, tapped holes 512A and 512B on the host guide500 are configured to be respectively aligned with through holes 410Aand 410B, and corresponding through holes in the front panel 312, whenthe host guide 500 is in the orientation of host guide 500A.Alternately, tapped holes 512C and 512D are configured to berespectively aligned with through holes 410C and 410D, and correspondingthrough holes in the front panel 312, when the host guide 500 is in theorientation of host guide 500B. Once the tapped holes 512A-512B of afirst host guide 500 and tapped holes 512C-512D of a second host guide500 are respectively aligned with through holes 410A-410B and 410C-410Dof the host bezel, and corresponding through holes in the front panel312, a plurality of screws or other fasteners can be received througheach set of aligned holes to secure the host bezel 400 to the first andsecond host guides 500.

In the embodiment shown in FIGS. 3 and 5A-5C, only two of the fourtapped holes 512A-512D are used, depending on the orientation 500A or500B of the host guide 500 within the host 300. For instance, when thehost guide 500 is in the orientation of host guide 500A, tapped holes512A-512B are used to secure the host guide 500 to the host bezel 400,while tapped holes 512C-512D remain unused. Alternately, when the hostguide 500 is in the orientation of host guide 500B, tapped holes512C-512D are used to secure the host guide 500 to the host bezel 400,while tapped holes 512A-512B remain unused. Thus, the two tapped holes512A-512B or 512C-512D are used depending on which set are oriented atthe front of host 300, or towards the front panel 312. Alternately, theunused tapped holes 512A-512B or 512C-512D can be used to secure thehost guide 500 to the host connector 600 when the through holes512A-512B or 512C-512D are oriented at the back of the host 300, ortowards the host connector 600.

Returning to FIGS. 5A-5C, the host guide 500 can optionally include oneor more posts 513A, 513B extending from the bottom of the host guide500. The one or more posts are configured to be received within one ormore corresponding cavities in the PCB 310 of FIG. 3 to help positionthe host guide 500 on the PCB 310 during assembly.

The host guide 500 further includes a first plurality of tapped holes514A and 514B extending downward from the top of the host guide 500, asecond plurality of tapped holes 516A and 516B extending upward from thebottom of the host guide 500 and a plurality of through holes 518A and518B extending through the host guide 500 from top to bottom.

The first plurality of tapped holes 514A and 514B are configured toreceive shoulder screws or other fasteners 112A-112D (see FIG. 1) forsecuring the optional heat sink 110 to the host guide 500. As shown inFIG. 5C, the tapped holes 514A and 514B are positioned in the host guide500 substantially symmetrically about a reference axis 519 that bisectsthe host guide 500 and is parallel to the y-axis. Alternately oradditionally, the tapped holes 514A and 514B can be positioned in thehost guide 500 asymmetrically about the reference axis 519.

The second plurality of tapped holes 516A and 516B are configured toreceive screws or other fasteners for securing the host guide 500 to thePCB 310 of FIG. 3. In particular, the tapped holes 516A and 516B areconfigured to align with through holes on the PCB 310 such that a screwor other fastener can be inserted through each set of aligned holes andthreaded into the tapped holes 516A and 516B. As shown, the tapped holes516A and 516B are positioned asymmetrically about the reference axis519.

Through holes 518A and 518B are also positioned asymmetrically aboutreference axis 519. Notably, however, through hole 518A and tapped hole516B are positioned substantially symmetrically about the reference axis519 while through hole 518B and tapped hole 516A are also positionedsubstantially symmetrically about the reference axis 519. The symmetryabout the reference axis 519 of each through hole 518A and 518B with acorresponding one of the tapped holes 516B and 516A, respectively,allows the host guide 500 to be used in belly-to-belly configurationswhere a host 300 is configured to receive a first module 200 on top ofthe PCB 310 and a second module 200 immediately beneath the first moduleon the bottom of the PCB 310. A cross-sectional view of an upper hostguide (“host guide 500U”) and a lower host guide (“host guide 500L”) ina belly-to-belly configuration on a PCB 310 is disclosed in FIG. 5D.

For the belly-to-belly configuration, the host guide 500U is positionedright-side-up on top of the PCB 310 while the host guide 500L ispositioned upside-down on the bottom of the PCB 310. Further, the hostguide 500U is in the orientation of host guide 500A of FIG. 3 while thehost guide 500L is in an upside-down orientation of host guide 500B ofFIG. 3.

As shown, through hole 518A of the host guide 500U aligns with a firstthrough hole 310A in the PCB 310 and with the tapped hole 516B of thehost guide 500L. Similarly, through hole 518B of the host guide 500Ualigns with a second through hole 310B in the PCB 310 and with thetapped hole 516A of the host guide 500L. After the through holes 518Aand 518B of the host guide 500U are aligned with the through holes 310Aand 310B of the PCB 310 and with the tapped holes 516B and 516A of thehost guide 500L, fasteners 520A and 520B can be inserted through eachset of aligned holes to secure the host guide 500U, PCB 310, and hostguide 500L together.

Alternately or additionally, fasteners can be inserted from the hostguide 500L through PCB 310 and into the host guide 500U using one ormore other sets of aligned holes. For instance, one other set of alignedholes includes through hole 518A of the host guide 500L, third throughhole 310C of the PCB 310, and tapped hole 516B of the host guide 500U.Yet another set of aligned holes includes through hole 518B of the hostguide 500L, fourth through hole 310D of the PCB 310, and tapped hole516A of the host guide 500U.

In a single-sided configuration where a module 200 is positioned only onthe top or bottom of the PCB 310, but not on both the top and bottom ofthe PCB 310, the host guide 500 of FIGS. 5A-5C can be secured to the PCB310 with two fasteners, including one fastener inserted through the PCB310 into the tapped hole 516A and another fastener inserted through thePCB 310 into the tapped hole 516B. In the belly-to-belly configurationof FIG. 5D, both host guides 500U and 500L can be collectively securedto the PCB 310 with the same number of fasteners as in the single-sidedconfiguration due to the symmetry about the reference axis 519 of eachthrough hole 518A and 518B with a corresponding one of the tapped holes516B and 516A, respectively. In comparison, however, the two fastenersused in the belly-to-belly configuration may be longer than the twofasteners used in the single-sided configuration.

C. Host Connector

With additional reference to FIGS. 6A-6H, the host connector 600 isdisclosed in greater detail. In particular, FIG. 6A discloses a frontperspective view, FIG. 6B discloses a front upside-down perspectiveview, and FIG. 6C depicts an exploded view of the host connector 600. Asshown, the host connector 600 includes a connector core 610 defining arecessed slot 612 (FIG. 6C) for receiving the module connector 250, aconnector cover 650 defining a cavity 652 (FIG. 6C) for receiving theconnector core 610, and EMI gaskets 680A and 680B configured to form anEMI shield at interfaces of the host connector 600 with the module 200and the PCB 310.

Together with FIG. 6C, FIG. 6D discloses details of the connector core610 in greater detail. The connector core 610 includes a connector body614. The recessed slot 612 is defined in the front face of the connectorbody 614. The connector body 614 comprises plastic dielectric in someembodiments, although the connector body 14 can alternately oradditionally comprise other reasonable materials. The connector body 614optionally includes one or more posts 616A, 616B extending from thebottom of the connector body 614. The one or more posts 616A, 616B areconfigured to be received within one or more corresponding cavities inthe PCB 310 of FIG. 3 to help position the connector core 610 on the PCB310 during assembly.

The connector core 610 additionally includes a plurality of contacts618, 620 partially enclosed within a plurality of chicklets 622. In someembodiments, the chicklets 622 are made from plastic. Alternately oradditionally, the chicklets can be made from other reasonable materials.Each chicklet 622 partially encloses two contacts 618 and 620, as bestseen in FIG. 6E, with the two contacts 618 and 620 best seen in FIG. 6F.

Each of the chicklets 622 includes one or more guiderails 624, 626configured to slide along corresponding channels defined in theconnector body 614 in order to properly align the chicklets 622 andcontacts 618, 620 within the connector body 614. In some embodiments,the chicklets 622 additionally include a hook feature 628 configured tosecure the chicklets within the connector body 614. In some examples,the chicklet 622 slides into the connector body 614 and “snaps” intoplace with the hook feature 628.

The chicklets 622 additionally include cutaway profiles 630, 632 toprovide solder joint visibility. In particular, each contact 618, 620includes a foot 618A, 620A extending outwards from cutaway profiles 630and 632 and further configured to be soldered or otherwise electricallycoupled to corresponding contact pads on the PCB 310. During assembly,the connector core 610 can be positioned on the PCB 310 such that eachof the feet 618A, 620A are aligned with corresponding contact pads onthe PCB 310. After alignment, the feet 618A and 620A can be electricallycoupled to the corresponding contact pads on the PCB 310 using a reflowsolder process or other coupling process. Once the soldering process iscomplete, the cutaway profiles 630, 632 allow each solder joint betweena foot 618A or 620A and corresponding contact pad on the PCB 310 to bevisually inspected for quality control.

Each contact 618, 620 additionally includes an arm 618B, 620B. The arms618B, 620B are configured to be coupled to corresponding upper and lowercontacts 254, 256 on the module connector 250, as disclosed in furtherdetail with respect to FIG. 7A below.

In some embodiments of contacts 618 and 620, high speed signal integrityis improved and EMI emission is significantly reduced compared toconventional host connector contacts due to the shape of the contact620. In particular, the uniform conductor cross section and absence ofconductive stubs eliminates impedance discontinuities that impair signalintegrity and increase EMI emissions.

With combined reference now to FIGS. 6C and 6G, additional details ofthe connector cover 650 are disclosed. The connector cover 650 comprisesmetal in some embodiments. As already mentioned above, the connectorcover 650 defines a cavity 652 (FIG. 6C) configured to receive theconnector core 610. The cavity 652 is accessed via a first opening 654defined in a bottom face 656 of the connector cover 650 and via a secondopening 658 defined in a front face 660 of the connector cover.

Optionally, the connector cover 650 can include one or more posts 661A,661B extending downwards from the bottom face 656. The one or more posts661A, 661B are configured to be received within one or morecorresponding cavities in the PCB 310 of FIG. 3 to help position theconnector cover on the PCB 310 during assembly.

A first plurality of tapped holes 662A, 662B are defined in theconnector cover 650 that extend upwards from the bottom face 656 andthat are positioned asymmetrically about a reference line 663 thatbisects the plane of bottom face 656 and is parallel to the z-axis. Thetapped holes 662A, 662B are configured to secure the host connector 600to the PCB 310 of FIG. 3. During assembly, after the contacts 622 of theconnector core 610 have been soldered to contact pads on the PCB 310,the connector cover 650 is dropped vertically over the connector core610 via the opening 654 defined in the bottom face 656 of the connectorcover 650 such that the connector core 610 is received within the cavity652 of the connector cover 650 and such that the tapped holes 662A and662B align with corresponding through holes on the PCB 310. Screws orother fasteners can then be inserted through the through holes in thePCB 310 and into the tapped holes 662A and 662B to secure the hostconnector 650 to the PCB 310.

A second plurality of tapped holes 663A, 663B are defined in theconnector cover 650 that extend backwards from the front face 660. Thetapped holes 663A, 663B are configured to receive the threaded ends226A, 228A of the thumbscrew 226, 228 (FIG. 2B) to secure the module 200to the connector cover 650. In some embodiments the threads in holes663A and 663B may be implemented with threaded inserts for improvedthread durability. The threaded inserts may be rigidly installed or havea small amount of float to aid thread alignment. In some embodiments,the front face 660 of the connector cover 650 acts as a hardstop withinthe host 300 for the module 200. Since the module 200 is fasteneddirectly to the host connector cover 650, and the connector core 610 ismechanically isolated from the host connector cover 650, the connectorcore 610 is protected from mechanical damage caused by external stress.

Securing the module 200 directly to the host connector 600 (e.g., viathe connector cover 650) can provide a number of advantages and/orbenefits. For instance, contacts 618, 620, 254, 256 in the hostconnector 600 and module connector 200 mate with less tolerance stackupcompared to contacts in host connectors and module connectors where themodule is secured directly to the front panel of the host. Consequently,the lengths of the contacts 618, 620, 254, 256 in the host connector 600and module connector 200 can be relatively shorter compared to contactsin conventional host connectors and module connectors and can includeshorter stubs, resulting in improved high speed signal integrity andimproved EMI performance.

As another advantage, the direct coupling of the module 200 to the hostconnector 600 allows the use of an elastomeric EMI gasket 680A to forman EMI seal at the interface of the module 200 with the host connector600. In particular, the use of EMI gaskets such as EMI gasket 680A oftenrequires tight mechanical tolerances at a compression interface, enabledin embodiments of the invention by direct coupling the module 200 to thehost connector 600. In contrast, in conventional systems where themodule is directly coupled to the front panel of the host or latched toother host features, tolerance stackup in the plugging direction (e.g.,the z-direction) must be compensated for at the interface between themodule and the host connector, resulting in loose mechanical tolerancesat the interface between the module and the host connector andpreventing the effective use of an elastomeric EMI gasket.

Returning to FIGS. 6C and 6G, a plurality of through holes 664A and 664Bare also defined in the connector cover 650 that extend from a top face666 (FIG. 6C) of the connector cover 650 to the bottom face 656. Throughholes 664A, 664B are positioned in the connector cover 650asymmetrically about the reference line 663. However, through hole 664Aand tapped hole 662B are positioned substantially symmetrically aboutthe reference line 663. Similarly, through hole 664B and tapped hole662A are positioned substantially symmetrically about the reference line663.

The symmetry of each through hole 664A and 664B with a corresponding oneof the tapped holes 662B and 662A, respectively, allows the hostconnector 600 to be used in belly-to-belly configurations withoutrequiring additional screws, nuts, bolts, or other fasteners than areotherwise used in single-sided configurations. A cross-sectional view ofan upper host connector (“host connector 600U”) and a lower hostconnector (“host connector 600L”) in a belly-to-belly configuration on aPCB 310 is disclosed in FIG. 6H.

For the belly-to-belly configuration, the host connector 600U ispositioned right-side-up on top of the PCB 310 while the host connector600L is positioned upside down on the bottom of the PCB 310. As shown,through hole 664A of the host connector 600U aligns with a fifth throughhole 310E in the PCB 310 and with the tapped hole 662B of the hostconnector 600L. Similarly, through hole 664B of the host connector 600Laligns with a sixth through hole 310F in the PCB 310 and with the tappedhole 662A of the host connector 600U. Although not shown, correspondingthrough holes and/or tapped holes in the host connector 600U, PCB 310and host connector 600L can be aligned on the other side of the hostconnectors 600U and 600L.

After the through holes and tapped holes in the host connector 600U arealigned with corresponding through holes in the PCB 310 andcorresponding tapped holes and through holes in the host connector 600L,fasteners can be inserted through one or more of the sets of alignedholes to secure the host connectors 600U, 600L and the PCB 310 together.For instance, fastener 668 can be inserted into the aligned set of holesincluding through hole 664A of the host connector 600U, through hole310E of the PCB 310, and tapped hole 662B of the host connector 600L.

The belly-to-belly configuration includes four sets of aligned holes,only two of which are shown in FIG. 6H, between the host connector 600U,PCB 310, and host connector 600L. The four sets of aligned holes includetwo sets that can be accessed from the top face 666 of host connector600U and two sets that can be accessed from the top face 666 of hostconnector 600L. In some embodiments, only two fasteners 668 are used tosecure the host connector 600U, PCB 310, and host connector 600Ltogether. For instance, fasteners can be inserted through each of thetwo sets of aligned holes accessed from the top face 666 of hostconnector 600U. Alternately, fasteners can be inserted through each ofthe two sets of aligned holes accessed from the top face 666 of hostconnector 600L Alternately, fasteners can be inserted through each ofthe four sets of aligned holes for a total of four fasteners.

In a single-sided configuration, two fasteners can similarly be used tosecure a host connector 600 to a single side of the PCB 310. In thisembodiment, one fastener can be inserted through the PCB 310 into eachof the tapped holes 662A and 662B. However, the two fasteners used inthe single-sided configuration can be shorter than the two fastenersused in the belly-to-belly configuration.

Returning to FIG. 6G, the connector cover 650 additionally includes afirst channel 670 defined in the front face 660 of the connector cover650 and a second channel 672 defined in the bottom face 656. The firstchannel 670 is configured to receive EMI gasket 680A and the secondchannel 672 is configured to receive EMI gasket 680B. The channels canbe sufficiently large in some embodiments to allow the use of hollow EMIgaskets, as seen in FIG. 7A. The use of hollow EMI gaskets 680A, 680Bcan reduce the compression force for compressing the EMI gaskets 680A,680B to form an EMI shield at the front face 660 and bottom face 656.

III. Assembly and Insertion

With combined reference to FIGS. 1-7B, additional details regarding themodule 200 and host 300 are provided. FIG. 7A is a cross-sectional viewof the back end of a module 200 coupled to a host PCB 310 disclosingdetails of the mechanical and electrical interface between the module200 and the host PCB 310. Illustrated in the cross-sectional view ofFIG. 7A are the top shell 212, bottom shell 214, and PCB 216 of themodule 200, as well as the module connector 250. The cross-sectionalview of FIG. 7A additionally illustrates the host PCB 310 and hostconnector 600 of the host 300.

In a typical assembly process of the host connector 600, contacts 618,620 are partially enclosed in chicklets 622. This may includeovermolding the chicklets 622 over the contacts 618, 622. Each chicklet622 and pair of contacts 618, 620 can be inserted into the connectorbody 614, the hook feature 628 of each chicklet 622 engaging acorresponding hook feature 634 in the connector body 614. Once all thechicklets 622 and contacts 618, 620 have been inserted into theconnector body 614, the connector core 610 is formed, the arms 618B,620B of the connectors 618, 622 extending into the recessed slot 612 ofthe connector core 610. The assembled connector core 610 would typicallybe provided pre-assembled by a connector manufacturer for use in thehost 300.

The assembled connector core 610 can then be positioned on the host PCB310, aligning the feet 618A, 620A of the contacts 618, 620 withcorresponding contact pads on the host PCB 310. The configuration of theconnector core 610 with a recessed slot 612 rather than a protrudingslot common in conventional host connectors allows the connector core610 to be positioned on the host PCB 310 for reflow soldering or someother coupling process without concern that the connector core 610 willtopple over. The connector core 610 configuration additionally allowssolder joints formed between the feet 618A, 620A and correspondingcontact pads on the host PCB 310 to be visually inspected for qualitycontrol. Further, the connector core 610 configuration permits aone-piece connector cover 650 to be implemented, as the connector core610 can be received into the cavity 652 defined in the connector cover650 via the opening 654 defined in the bottom face 656 of the connectorcover 650. The one piece connector cover 650 is installed over theconnector core 610 with a simple, vertical assembly motion.

Prior to assembling the connector cover 650 over the connector core 610on the host PCB 310, EMI gaskets 680A, 680B are positioned in thechannels 670, 672 defined in the front face 660 and bottom face 656 ofthe connector cover 650. Once so assembled, the connector cover 650 isdropped over the connector core 610 onto the host PCB 310 where it canbe secured using one or more fasteners.

Host guides 500A, 500B are positioned and secured on the host PCB 310.The host bezel 400 is secured directly to the host guides 500A, 500Bthrough the front panel 312, the opening 403 of the host bezel 400 beingaligned with the oversized opening of the front panel 312 and theposition of the front panel 312 being adjustable relative to theposition of the host bezel 400 and host guides 500A, 500B. The directcoupling of the host guides 500A, 500B to the host bezel 400 cancompensate for host PCB 310 tolerances, as already explained above, andcan alternately or additionally increase the rigidity of the host 300.In contrast, in a conventional system without host bezels, the largeopenings in the front panel of the host for receiving pluggable moduleswould compromise the rigidity of the host 300. Moreover, in someembodiments, fastening the host bezel 400 directly to the host guides500A and 500B ensures proper alignment of the host bezel 400 relative tothe host guides without requiring precise alignment with the front panel312.

When a user desires to plug the module 200 into the host 300, the useraligns the guiderails 222, 224 with cutouts 405, 404 in the host bezel400 and channels 508A, 508B in host guides 500A, 500B. As the module 200is pushed through the opening 403 defined in the host bezel 400, theguiderails 222, 224 run along the cutouts 405, 404 and channels 508A,508B until the back of the module 200 mates with the front of the hostconnector 600 (e.g., the front surface 660 of the connector cover 650).At that time, the user may exert an inward pressure on the thumbscrews226, 228 to overcome the outward biasing effect of the compressionsprings 232, 234, which will cause the screw ends 226A, 228A to enterthe tapped holes 663A, 663B of the host connector 600. The user may thentighten the thumbscrews 226, 228 to securely fasten the module 200 intothe host 300.

In the insertion position illustrated in FIG. 7A, the tongue 258 of themodule connector 250 is received into the recessed slot 612 of the hostconnector 600. The arm 618B of the contact 618 is coupled to the uppercontact 254 of the module connector 250. Similarly, the arm 620B of thecontact 620 is coupled to the lower contact 256 of the module connector250. The shoulder 260 of the module connector 250 extends into therecessed slot 612 of the host connector 600, enclosing the contacts 618,620 and/or 254, 256 in plastic dielectric in some embodiments andreducing and/or preventing the exposure of the contacts 618, 620 and/or254, 256 to air.

As seen in FIG. 7A, the thickness of the tongue 258 is greater than thethickness of the PCB 216, although this is not required in allembodiments. The greater thickness of the tongue 258 allows the use ofstraight contacts 254, 256, rather than joggled contacts as alreadymentioned above.

As previously described, the host connector 600 provides a hardstop forthe module 200, such that the module connector 250 and host connector600 mate with less tolerance stackup compared to conventional systemswhere the front panel of the host provides the hardstop. Instead, mostof the tolerance stackup of the module 200 insertion into the host 300is compensated for at the front of the module 200 in some embodiments.

For instance, FIG. 7B discloses a cross-sectional view of the module 200inserted through the opening 403 defined in the host bezel 400 and theoversized opening defined in the front panel 312. FIG. 7B furtherdiscloses an upper EMI finger 236A and a lower EMI finger 236B of theEMI collar 236. When the module 200 is inserted into the host 300, theupper EMI finger 236A is compressed and wipes the inner surface of thetop 406A of host bezel 400, while the lower EMI finger 236B iscompressed and wipes the inner surface of the bottom 406B of host bezel400. The wiping contact of the EMI fingers 236A, 236B with the innersurfaces of the rim 406 forms an EMI shield at the interface of themodule 200 with the host bezel 400.

Because the contact between the EMI gasket 236 and the host bezel 400 isa wiping contact, rather than a compression contact, the host bezel 400and EMI collar 236 can compensate for a significant tolerance stackup,illustrated as the distance Δ in FIG. 7B. In other words, so long as thetolerance stackup in the module 200 and host 300 results in the EMIfingers 236A, 236B being positioned somewhere between the referencelines 702, 704 separated by the distance Δ, the EMI fingers 236A, 236Band the rest of the EMI collar 236 can form an adequate EMI shield withthe host bezel 400.

Alternately or additionally, the maximum tolerance stackup in the module200 and/or host 300 can be less than Δ in some embodiments. When Δ isgreater than the maximum tolerance stackup, the mechanical platform 100,including the module 200 and host 300, can accommodate front panels 312with a range of thicknesses. For instance, in some embodiments themechanical platform 100 can accommodate front panels 312 withthicknesses anywhere from 1 millimeter to 3 millimeters. Theaccommodation of different front panel 312 thicknesses allows differentfront panel manufacturers to manufacture front panels 312 with differentthicknesses.

The present invention may be embodied in other specific forms withoutdeparting from its spirit or essential characteristics. The describedembodiments are to be considered in all respects only as illustrativeand not restrictive. The scope of the invention is, therefore, indicatedby the appended claims rather than by the foregoing description. Allchanges which come within the meaning and range of equivalency of theclaims are to be embraced within their scope.

1. A module, comprising: a shell having a front, back, first side, andsecond side; a first guiderail protruding from the first side andextending from the front of the shell to the back of the shell; a secondguiderail protruding from the second side and extending from the frontof the shell to the back of the shell; a first thumbscrew running thelength of the module and housed within the first guiderail; a secondthumbscrew running the length of the module and housed within the secondguiderail, wherein the first thumbscrew and second thumbscrew areconfigured to secure the module to a host device when the module isplugged into the host device; and a first compression spring housedwithin the first guiderail around the first thumbscrew and a secondcompression spring housed within the second guiderail around the secondthumbscrew, the first and second compression springs configured to biasthe first and second thumbscrews towards the front of the shell.
 2. Themodule of the claim 1, wherein the shell comprises a shell assemblyincluding a top shell and a bottom shell, and the first guiderailprotrudes from the first side at a first intersection of the top shelland the bottom shell and the second guiderail protrudes from the secondside at a second intersection of the top shell and the bottom shell. 3.The module of claim 2, wherein: the top shell is configured to becoupled to a heatsink attached to the host device; or the top shellincludes an integrated heatsink.
 4. The module of claim 1, wherein theshell defines a cavity, further comprising: a printed circuit boarddisposed within the cavity, the printed circuit board including a padpattern near the back of the shell; and a module connector coupled tothe pad pattern and including: a tongue configured to be received withina recessed slot of a host connector included in the host device; and aplurality of contacts coupled to contact pads on the pad pattern andconfigured to be coupled to corresponding contacts in the hostconnector.
 5. The module of claim 4, wherein the plurality of contactsof the module connector include upper contacts and lower contacts, theupper and lower contacts configured to straddle mount the pad pattern ofthe printed circuit board.
 6. The module of claim 4, wherein theplurality of contacts are straight.
 7. The module of claim 4, furthercomprising a shoulder surrounding the tongue and configured to bereceived within the recessed slot to prevent exposure of the pluralityof contacts of the module connector and of the host connector to air. 8.The module of claim 1, wherein the host device includes a host bezeldefining an opening configured to receive the module, the module furthercomprising a collar surrounding the front of the shell, the collarconfigured to be coupled to an inner surface of the host bezel and forma shield against leakage of electromagnetic interference through theinterface between the module and the host bezel.
 9. The module of claim1, wherein the first guiderail is configured to slide along a firstchannel in the host device and the second guiderail is configured toslide along a second channel in the host device when the module isplugged into the host device.
 10. The module of claim 1, wherein thehost device includes a host connector configured to electrically couplethe host device to the module, and wherein the first thumbscrew andsecond thumbscrew are configured to secure the module directly to thehost connector.
 11. A system, comprising: a host device configured toreceive a pluggable module, the host device including: a host printedcircuit board; a host connector coupled to the host printed circuitboard and defining a recessed slot configured to receive a moduleconnector of the pluggable module; a first guide and a second guidecoupled to the host printed circuit board, the first guide defining afirst channel and the second guide defining a second channel, the firstand second channels configured to receive first and second guiderails ofthe pluggable module; and a host bezel coupled to the first and secondguides and defining an opening configured to receive the pluggablemodule; and the pluggable module including a front, back, first side,and second side opposite the first side, and further including: themodule connector disposed at the back of the pluggable module andconfigured to be inserted into the recessed slot of the host connector;the first guiderail protruding from the first side of the pluggablemodule and configured to engage the first channel of the first guide;and the second guiderail protruding from the second side of thepluggable module and configured to engage the second channel of thesecond guide.
 12. The system of claim 11, wherein the pluggable moduleis substantially compliant with the 100 G form-factor pluggable (“CFP”)multi-source agreement (“MSA”).
 13. The system of claim 11, wherein thepluggable module further includes a first thumbscrew running the lengthof the pluggable module and housed within the first guiderail and asecond thumbscrew running the length of the pluggable module and housedwithin the second guiderail, the first and second thumbscrews configuredto secure the pluggable module to the host device.
 14. The system ofclaim 13, wherein the first and second thumbscrews are configured tosecure the pluggable module directly to the host connector.
 15. Thesystem of claim 11, wherein the pluggable module further includes acollar surrounding the pluggable module at the front of the pluggablemodule, the collar configured to be compressed by the host bezel whenthe pluggable module is plugged into the host device and to wipe aninner surface of the host bezel, the collar and the host bezelconfigured to form a shield against leakage of electromagneticinterference through an interface between the pluggable module and thehost bezel.
 16. The system of claim 15, wherein the collar and the hostbezel enable the system to accommodate tolerance stackup in thepluggable module.
 17. The system of claim 11, further comprising aheatsink configured to be removably attached to the host device andthermally coupled to the pluggable module to dissipate heat away fromthe pluggable module.
 18. The system of claim 17, further comprising athermal pad configured to be positioned between the pluggable module andthe heatsink and to improve the ability of the heatsink to dissipateheat away from the pluggable module.
 19. The system of claim 11, whereinthe pluggable module includes a top shell with integrated heatsinkconfigured to dissipate heat away from the pluggable module.
 20. Thesystem of claim 19, wherein the integrated heatsink comprises: a firstfin extending from a top surface of the top shell; a second finextending from the top surface of the top shell; and a first gap definedbetween the first and second fins, wherein, when the module is pluggedinto the host device, top surfaces of the first and second fins makedirect contact with a bottom surface of the heatsink, the heatsinkcomprising third and fourth fins extending from a top surface of theheatsink and a second gap defined between the third and fourth fins, theratio of the width of the first fin and the width of the first gap beinggreater than the ratio of the width of the third fin and the width ofthe second gap.
 21. The system of claim 20, further comprising aplurality of shoulder screws removably securing the heatsink to the hostdevice, each shoulder screw having a compression spring configured tobias the heatsink against the top surfaces of the first and second fins.22. The module of claim 2, wherein the top shell comprises an integratedheatsink, the integrated heatsink comprising: a first fin extending froma top surface of the top shell; a second fin extending from the topsurface of the top shell; and a first gap defined between the first andsecond fins, wherein, when the module is plugged into the host device,top surfaces of the first and second fins make direct contact with abottom surface of a second heatsink attached to the host device, thesecond heatsink comprising third and fourth fins extending from a topsurface of the second heatsink and a second gap defined between thethird and fourth fins, the ratio of the width of the first fin and thewidth of the first gap being greater than the ratio of the width of thethird fin and the width of the second gap.
 23. The module of claim 22,wherein the module is substantially compliant with the CFP MSA.
 24. Amodule comprising: a printed circuit board; a shell enclosing at least aportion of the printed circuit board, the shell comprising an integratedheatsink, the integrated heatsink comprising: a first fin extending froma top surface of the shell; a second fin extending from the top surfaceof the shell; and a first gap defined between the first and second fins,wherein the module is configured to be plugged into a host device havinga second heatsink attached thereto such that top surfaces of the firstand second fins make direct contact with a bottom surface of the secondheatsink, the second heatsink comprising third and fourth fins extendingfrom a top surface of the second heatsink and a second gap definedbetween the third and fourth fins, the ratio of the width of the firstfin and the width of the first gap being greater than the ratio of thewidth of the third fin and the width of the second gap.
 25. The moduleas recited in claim 24, wherein the width of the first fin is aboutequal to the width of the first gap.
 26. The module as recited in claim24, wherein the width of the first fin is about equal to the width ofthe second fin.
 27. The module as recited in claim 24, wherein the shellcomprises a top shell connected to a bottom shell, and wherein theintegrated heatsink is formed in the top shell.
 28. The module asrecited in claim 27, wherein the integrated heatsink further comprises aplurality of additional fins between each pair of which an additionalgap is defined.
 29. The module as recited in claim 24, wherein themodule is substantially compliant with the 100 G form-factor pluggable(“CFP”) multi-source agreement (“MSA”).